Test Structures for the Characterisation of Sensor Packaging Technology
Date Available
2017-01-13Type
datasetData Creator
Blair, Ewen OPublisher
University of Edinburgh, School of Engineering, Institute of Micro and Nano SystemsRelation (Is Referenced By)
https://www.research.ed.ac.uk/portal/en/publications/test-structures-for-the-characterisation-of-sensor-packaging-technology(32812bee-5218-4ed3-b9fa-42dd29c909db).htmlMetadata
Show full item recordAltmetric
Citation
Blair, Ewen. (2017). Test Structures for the Characterisation of Sensor Packaging Technology, 2016-2017 [dataset]. University of Edinburgh, School of Engineering, Institute of Micro and Nano Systems. https://doi.org/10.7488/ds/1695.Description
This dataset corresponds to a conference paper which presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.The following licence files are associated with this item: