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Depositordc.contributorWalton, Anthony
Funderdc.contributor.otherEPSRC - Engineering and Physical Sciences Research Councilen_UK
Spatial Coveragedc.coverage.spatialUKen
Spatial Coveragedc.coverage.spatialUNITED KINGDOMen
Data Creatordc.creatorWalton, Anthony J
Citationdc.identifier.citationWalton, Anthony. (2017). Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature, [dataset]. University of Edinburgh. School of Engineering.
Persistent Identifierdc.identifier.uri
Persistent Identifierdc.identifier.uri
Dataset Description (abstract)dc.description.abstractThis article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used respectively as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS.en_UK
Publisherdc.publisherUniversity of Edinburgh. School of Engineeringen_UK
Rightsdc.rightsCreative Commons Attribution 4.0 International Public Licenseen
Subjectdc.subjectNi-Fe integrationen_UK
Subjectdc.subjectSurface Micromachiningen_UK
Subjectdc.subjectSelective Etchingen_UK
Subjectdc.subjectNi-Fe Electroplatingen_UK
Subjectdc.subjectMagnetic Microactuatorsen_UK
Subject Classificationdc.subject.classificationEngineeringen_UK
Titledc.titleIntegration of Electrodeposited Ni-Fe in MEMS with Low-Temperatureen_UK

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