SUPERSEDED - Test Structures for Developing Packaging for Implantable Sensors
Data CreatorSmith, Stewart
Walton, Anthony J
Blair, Ewen O
Marland, Jamie R K
Gray, Mark E
Terry, Jonathan G
PublisherUniversity of Edinburgh. School of Engineering. Institute of Micro and Nanosystems
Relation (Is Referenced By)https://doi.org/10.1109/TSM.2020.2987134
MetadataShow full item record
CitationSmith, Stewart; Walton, Anthony J; Blair, Ewen O; Buchoux, Anthony; Tsiamis, Andreas; Dunare, Camelia; Marland, Jamie R K; Gray, Mark E; Terry, Jonathan G. (2020). SUPERSEDED - Test Structures for Developing Packaging for Implantable Sensors, [dataset]. University of Edinburgh. School of Engineering. Institute of Micro and Nanosystems. https://doi.org/10.7488/ds/2638.
Description## This dataset has been replaced by the one that can be found at: https://doi.org/10.15129/f9eb43b5-9d4b-49fc-ad53-f565f03bfc78 ## With their capacity for real time monitoring and spatial mapping, implantable sensors are becoming an increasingly important aspect of next generation precision healthcare. Microfabricated sensor systems are a popular choice, owing to their capacity for miniaturisation, repeatable mass manufacture, and numerous pre-existing sensor archetypes. Despite the drive for development, packaging these sensors for the environment within the body, as well as the implantation process itself, presents a significant challenge. This paper presents microelectronic test structures, which can be used to assess, compare, and optimise implantable packaging solutions in a standardised manner. The proposed structures are used to investigate: (i) permeability of the insulation material, (ii) adhesion of the encapsulant to the die, (iii) capacity of the material to be patterned, and (iv) physical robustness of the package to implantation through a needle. They are used to characterise an example packaging strategy, using biocompatible epoxy-resin. In addition, a method of optimising the packaging performance using the test structures is presented.
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